Revolutionizing Chip Production: Hanmi Semiconductor’s Leap into AI-Driven DRAM Innovation
Hanmi Semiconductor, a cornerstone in chip packaging equipment, has recently seen a leadership transition with Kwak Dong-shin stepping up as chairman. Under his guidance, the company has been pivotal in developing the Thermal Compression (TC) bonder, a cutting-edge technology essential in manufacturing High Bandwidth Memory (HBM) chips. These advanced DRAM chips are crucial for augmenting the AI processing capabilities of graphics processing units (GPUs), positioning Hanmi as a leader in the AI semiconductor sector.